Aluminum substrate anodic oxidation treatment "OGF treatment"
Low outgassing! Surface treatment for semiconductor components that improves heat resistance and corrosion resistance.
Nikkoshi's "OGF treatment" is an oxidation coating process for non-porous, crack-free aluminum substrates. By performing OGF treatment, the gas emissions from the surface when heated to temperatures between 50 and 400°C are almost the same as that of pure aluminum, and no cracks occur in the oxidation coating even near 450°C. It can form a coating with almost uniform thickness on complex shapes, and treatment is possible for both through holes and blind holes. 【Features】 ■ Semiconductor → Water treatment coating, usable in highly acidic environments ■ Unlike anodizing, this treatment does not peel off ■ Expands along with thermal expansion ■ Superior corrosion resistance compared to sulfuric anodizing and oxalic anodizing ■ Treatable size: 1200×1000×500mm, maximum weight 450kg *For more details, please refer to the catalog or feel free to contact us.
- Company:ニッコーシ
- Price:Other